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Semiconductor devices

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97/231121DC

IEC 60191-2. Proposal for a plastic shrink small outline package (SSOP), 1,00 mm lead length, outline family R-PDSO-G (47D/200/CDV). Dimensions. Plast...

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98/230486DC

IEC 60191-4. Mechanical standardization of semiconductor devices. Part 4. Coding system and classification into forms of package outlines for semicond...

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DC99/203697

Draft British Standard BS IEC 60191-2-A28 Mechanical standardization of semiconductor devices. Dimensions. Plastic small outline package J-lead (P-SOJ...

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DC99/203699

Draft British Standard BS IEC 60191-2-A20 Mechanical standardization of semiconductor devices. Dimensions. Plastic thin small outline package(P-TSOP I...

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